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Citigroup: Pinduoduo, which operates retail platform Temu, is likely to continue to face short-term disadvantages. Maintain the neutral rating of ADR in Pinduoduo and set the target price of ADR in Pinduoduo at $125.00. Note: The latest ADR report in Pinduoduo is $103.42.Thailand's consumer confidence index rose to 56.9 in November, boosted by stimulus measures, and Thailand's consumer confidence index rose from 56.0 to 56.9 in November.Nanchang land port "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train was opened. On the morning of December 12th, two trains loaded with "Made in Jiangxi" drove out of Nanchang land port in turn under the supervision of Ganjiang New District Customs, marking the official opening of the "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train from Nanchang land port to Xiamen Port, which greatly boosted the construction of modern logistics system in Jiangxi to a new level.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)India's SENSEX30 index opened 0.06% lower at 81,476.76 points. Among the constituent stocks, State Power of India opened 0.79% higher, Mahengda Information Technology rose 0.56%, and Tata Motors rose 0.5%; In terms of decline, HDFC BANK opened 0.74% lower, Bharti Telecom fell 0.68%, and Unilever of India fell 0.53%.Hua Fu Securities completed the capital increase and share expansion of over 4.7 billion yuan, and the Shanghai United Assets and Equity Exchange issued a closing announcement: the capital increase and share expansion project of Hua Fu Securities was launched. There were 17 participants in this capital increase, including 4 original shareholder units and 13 new investors, with a total investment of about 4.757 billion yuan. According to China, a brokerage firm, Hua Fu Securities' capital increase and share expansion has attracted wide attention in the market, becoming the largest equity financing case in the securities industry this year.

The word "Jin" was elected as the Japanese Chinese character of the year in 2024. According to NHK, on the afternoon of December 12, local time, Kiyomizu Temple in Kyoto, Japan announced the word "Jin" as the Japanese Chinese character of the year in 2024. According to the report, this year's word "gold" has two meanings. One is that athletes such as Japanese Olympic athletes have performed well and issued a shining "golden light"; The second is the political black gold problem in Japanese politics and frequent robberies caused by underground part-time jobs, because the pronunciation of "gold" in Japanese, like the word "shadow", also implies the meaning of "shadow". (China News Network)Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Xia Yiping's internal letter was alleged to have been copied from Weilai Li Bin. Xia Yiping, CEO of Jiyue, released an internal letter on the afternoon of 11th, acknowledging that the company was encountering difficulties and needed to adjust immediately. Some netizens pointed out that part of Xia Yiping's internal letter copied the internal letter of Weilai Li Bin in 2023. Xia Yiping's internal letter mentioned that the following four things must be done well in the new entrepreneurial period: 1. Adhere to the long-term investment in core technologies to maintain the leading edge; 2. Strengthen sales and service capacity building to cope with fierce market competition; 3. Merge departments and posts with duplicate functions and change inefficient internal workflow; 4. Reduce projects that cannot improve financial performance in the short term. In 2023, Li Bin's internal letter also mentioned: ensure long-term investment in core key technologies and maintain the leading edge of technology and products; Ensure that sales and service capabilities can cope with fierce market competition; Ensure that 9 core products of 3 brands are listed as scheduled; Organize efficiency improvement, merge redundant departments and posts, change inefficient internal workflow and division of labor, and cancel inefficient posts; Improve the efficiency of resources, postpone and reduce the project investment that can not improve the company's financial performance within 3 years. (Sina Technology)